Sensors and Systems
Breaking News
NASA Satellites Reveal Abrupt Drop in Global Freshwater Levels 
Rating12345An international team of scientists using observations from NASA-German...
Geo Week Announces Keynote – Francis Scott Key Bridge: Rescue, Recovery, and Rebuild
Rating12345Experts from USGIF, NOAA’s National Geodetic Survey, and Army...
Exodigo Expands Transportation Leadership Team to Meet Intensifying Demand for Capital Project Support
Rating12345Appoints Rod Lacy, PE as Vice President of U.S....

May 12th, 2022
Teledyne Geospatial to exhibit advanced lidar and software solutions at Geo Business 2022

  • Rating12345

Vaughan, Ontario, CANADA – May 12, 2022 –Teledyne Geospatial will showcase their airborne, UAV and mobile lidar solutions at Geo Business 2022, being held at ExCeL London from May 18-19, 2022.

Visit Teledyne Geospatial booth # GE15 to learn about the Optech Galaxy airborne lidar with the smallest laser footprint in the market, offering superior detection on small features like wires and forest ground.  The Galaxy also boasts 2 million points per second, the highest single pass point density with a programmable field of view which focuses all points on the ground to avoid the need for multiple passes over the same area.

Visitors to the booth can also learn how the Optech CL-360 enables OEM manufacturers and integrators to develop best-in-class solutions for mapping, engineering, transportation, utility, and object detection applications. The sensors versatile 360-degree scanner has no blind spots making it ideal for both airborne and vehicle mounted work with programmable 50-250 lines per second to distribute data evenly.

Teledyne Geospatial unifies the hardware and software expertise of both Teledyne CARIS and Teledyne Optech. The new group provides customers with innovative integrated solutions. Offerings include turnkey systems, lidar and sonar integrated workflows and a range of systems and solutions that support holistic, precision data collection.

Leave a Reply

Your email address will not be published. Required fields are marked *